2017 is almost nearing its end, which means that after the second generation Google Pixel launches, we will have to wait for next year for major flagship smartphone announcements. Samsung is expected to announce their Galaxy S9 early next year, followed by other renowned manufacturers. However, reports from China are stating that Qualcomm is possibly working with Xiaomi to optimise their upcoming Snapdragon 845 chipset for the Mi 7.
A report from GizmoChina suggests that Qualcomm is already working with Xiaomi to optimise the chip for Xiaomi’s next year’s flagship offering — the Mi 7. The Snapdragon 845 is expected to debut with an undisclosed combination of Cortex A75 cores, Adreno 630 GPU and an X20 LTE Gigabit modem. Xiaomi’s 2017 flagship Mi 6 is amongst those smartphones with extremely high benchmark scores.
The Snapdragon 845 chipset will be manufactured on the 10nm FinFET process by Samsung. This chipset is expected to debut with the Galaxy S9 and will also be available on the Mi 7. Xiaomi and Qualcomm are possibly working on making the SD845 SoC work seamlessly with MIUI, which is Xiaomi’s custom, resource heavy skin.
The report also mentions some features expected on the Mi 7. The smartphone is expected to feature a 6-inch fullscreen OLED display, which will be made by Samsung. It will adopt the 18:9 screen ratio. The Mi 7 will also feature a dual camera setup at the back and will have a glass/ceramic body. The smartphone is expected to be priced at Rs 30,000 in China.