PM To Lay Stone For Semiconductor Packaging Unit In Vizag

Chief minister Chandrababu Naidu, Union minister Ashwini Vaishnaw, and state IT minister Nara Lokesh will be present.

ASIP is establishing south India's first ISM-approved outsourced semiconductor assembly and test (OSAT) facility in Visakhapatnam. Representing an initial planned investment of `2,387.81 crore across two phases, this project marks a historic milestone in India's domestic semiconductor packaging ecosystem.

Around 1000 and above direct highly skilled and 1600 indirect jobs are expected to be created over the coming years.

The projects include semiconductor packaging, electronics manufacturing and component production, with major investments planned in Visakhapatnam and other industrial regions.

The project is being established in Tarluvada Village, Anandapuram Mandal, Visakhapatnam district. Its production capacity will be 96 million chips per year, and the focus segments will be AI, high performance computing, data centres and high-speed communication.

The facility will serve both domestic demand and export markets, supporting India’s electronics and digital infrastructure growth.