2017 is almost over, which means we get to see new flagship smartphones from all the big names of the smartphone industry. The world of smartphone rumours suggests that Samsung will start the year pretty early with its Galaxy S9 flagship by the end of January and we already have a fair bit of idea about the chipset that will power the Galaxy S9.
Samsung has been selling its flagship models in two variants always — a Snapdragon variant (for select markets) and an Exynos variant for most of the market it operates in. While it is known that the Snapdragon 845 will debut with the Galaxy S9, Samsung’s in-house chipset will also get a major upgrade. According to a press release, the chipset is called Exynos 9 Series 9810 and will be built on the second generation 10nm FinFET process. Samsung claims that the chipset will host third generation custom CPU cores, upgraded GPU, and gigabit LTE modem with industry-first 6CA support.
Along with the SoC, Samsung has also documented a camera sensor that we think could make it to the S9. The ISOCELL Slim 2X7 is a 24MP sensor with 0.9μm pixels. It also comes Tetracell and remosaic technology to simulate bigger pixel performance, making it the obvious choice for Samsung to go for this sensor on its flagship if it has any intention of making the Galaxy S9 slimmer than before.
Samsung hasn’t mentioned any hint of the Galaxy S9 anywhere in the press release but new processor and image sensor clearly hint towards their presence on the next Samsung Galaxy flagship. The Galaxy S9 is expected to be an improved version of the Galaxy S8, sporting the Infinity Display with even more narrow bezels and dual rear cameras. It is expected to come with Android Oreo out of the box.