Qualcomm is reported to unveil the Snapdragon 670 in the first quarter next year. GSM Arena reports that the upcoming SoC will be the first to be manufactured using the 10nm manufacturing process.
The SoC is said to be built using the 10nm Low Power Plus (LPP) technology instead of the Low Power Early (LPE) technology that was used to manufacture the Snapdragon 835 and the Exynos 8895 processor.
The report also claims that the chip will come with an octa-core Kryo CPU comprising of two Kryo 360 cores. The alleged chip is rumoured to use DynamIQ technology packing a Cortex A75 and Cortex A55. The GPU is also said to jump to 6-series from the recent 5-series.
In May the company announced the 660 and the 630. Both are very similar in most aspects. The 660 is for devices with a 2K display (usually 2560x1440), while the 630 is for devices with a Full HD display (1920x1080), though the latter can support a higher resolution.
