India’s First 3d Chip Packaging Unit Foundation Laid In Odisha’s Bhubaneswar
The project aligns with the broader vision of Atmanirbhar Bharat and is expected to position Odisha as a key hub in next-generation semiconductor infrastructure: Reports
BHUBANESWAR: In a significant stride towards strengthening India’s semiconductor ecosystem, the foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley in Bhubaneswar, marking a major milestone in the nation’s push for self-reliance in high-end electronics manufacturing.
The project aligns with the broader vision of Atmanirbhar Bharat and is expected to position Odisha as a key hub in next-generation semiconductor infrastructure. The facility will focus on advanced 3D glass-based packaging technologies, which are critical for high-performance computing, artificial intelligence, and next-generation communication systems.
Addressing the gathering, Odisha Chief Minister Mohan Charan Majhi described the initiative as a “historic milestone” for both the state and the country. He underscored that this is the first time such an advanced 3D Glass Solutions semiconductor project is being established in India, placing Odisha at the forefront of cutting-edge technological innovation.
Highlighting the state’s growing industrial appeal, Majhi noted that global technology leaders such as Intel, Lockheed Martin, and Applied Materials are closely associated with advanced packaging technologies. Their increasing engagement signals rising investor confidence in Odisha’s evolving electronics manufacturing ecosystem.
According to official estimates, the project entails an investment of nearly Rs 2,000 crore. Once operational, the unit is expected to manufacture around 70,000 glass panels annually, along with approximately 50 million assembled units and nearly 13,000 advanced 3D heterogeneous integration (3DHI) modules.
The Chief Minister further pointed out that Odisha is uniquely positioned as the only state in India to host both the country’s first compound semiconductor fabrication unit and its first 3D glass substrate packaging facility. This dual advantage is likely to catalyse further investments, foster innovation, and generate significant employment opportunities.
“With this development, Odisha strengthens its claim as an emerging hub in India’s semiconductor value chain, contributing meaningfully to the country’s ambition of becoming a global electronics manufacturing powerhouse,” said CM Majhi.
