Apple plans to introduce waterproof iPhones

Suggested by various reports, Apple plans to make some major hardware advances with its upcoming smartphones. It will release the upgraded 4-inch iPhone C series in the second quarter of 2016, and around the same time it will introduce the next generation iPhone. The major selling points of the next iPhone will be the 3GB memory upgrade for the 5.5-inch model and a waterproof feature.

As for the current market leader Samsung, it is believed that Apple will still have the largest market share worldwide in 2016. Apple is anticipated to significantly narrow its market share gap with Samsung next year as well.

Also Read: This is how Apple will waterproof its future iPhones

Processors made on 14/16nm manufacturing processes will be the first choice for smartphone vendors when it comes to building their next year’s high-end products. The advantage of advanced processes is the ability to make chips that use less power and are less susceptible to overheating. Since much of the 14/16nm capacity next will be used to supply chips for high-end smartphones, the production of components for low-end and mid-range devices will concentrate on the 28nm process.

As the next-generation mobile memory, LPDDR4 accounts for a growing share of the overall mobile DRAM production. Since DRAM manufacturing will be mainly on the 20nm process next year, the share of 8Gb/6Gb mono die in the mobile DRAM production will also increase, significantly raising the memory density of each smartphone unit. Most mid-range devices for next year will have 3GB of memory while high-end devices will be equipped with 4GB/6GB of memory.

In terms of display specs, FHD will prevail over HD as the mainstream display technology for smartphones next year. Vendors will even use QHD display to separate their top-of-the-line devices from products of the lower segments. More models will also feature narrow bezel and curved screen.

Source: TrendForce

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